1. Articulate the value behind and demonstrate effective teamwork and collaboration
2. Demonstrate adaptability and flexibility
3. Demonstrate strong communication skills through the selection of the appropriate communication method for each message
4. Demonstrate strong presentation skills through quality materials and clear presentation
5. Demonstrate appropriate use of email for general communications
6. Demonstrate appropriate use of Slack for general communications
7. Demonstrate appropriate use of Slack as a collaboration tool

1. Understand the importance of feedback in all we do
2. Deliver quality feedback to team members
3. Receive feedback gracefully and act on it
4. Model goal setting behaviors through performance management system
5. Model a culture of feedback with all team members

1. Understand and demonstrate knowledge around IBM Business Conduct Guidelines, cybersecurity and other organizational policies as required
2. Model professional behavior and utilize established security protocols

1. Demonstrate knowledge of Microelectronic Packaging components and their function
2. Demonstrate knowledge of the sequential process steps used to fabricate Microelectronic Packages
3. Demonstrate knowledge of the layout of the assembly line

1. Demonstrate knowledge of common microelectronic Failure Analysis techniques
2. Demonstrate knowledge of how microelectronic packaging assembly processes can be aided by Failure Analysis

1. Demonstrate knowledge of 2017 IBM General Safety and Environment Course
2. Demonstrate knowledge of East Fishkill Site Common Department Safety Procedure
3. Demonstrate knowledge of Fundamentals of Ergonomics for Office, Remote, and Mobile Employees
4. Demonstrate knowledge of HAZCOM Safety Training
5. Demonstrate knowledge of Electrical Safety
6. Demonstrate knowledge of Working Safely With Radiation: Fundamentals of Ionizing Radiation
7. Demonstrate knowledge of Laboratory Chemical Hygiene
8. Demonstrate knowledge of Laser Safety
9. Demonstrate knowledge of Lead Safety and the OSHA Lead Standard
10. Demonstrate knowledge of Personal Protective Equipment

1. Demonstrate knowledge of IBM’s Procurement Processes Practices
2. Demonstrate ability to use and leverage procurement tools

1. Demonstrate basic knowledge of Export Compliance
2. Demonstrate ability to use and leverage IBM’s international shipping process

1. Demonstrate knowledge of C4 Interconnect Technology
2. Demonstrate knowledge of Wafer Dicing Processes
3. Demonstrate knowledge of Chip Join, Ball Grid Array (BGA) attach, & 2nd Level Assembly Processes
4. Demonstrate knowledge of Under fill Processes
5. Demonstrate knowledge of Module Capping Processes
6. Demonstrate knowledge of Packaging Measurements & Confocal Scanning Acoustic Microscopy (CSAM)

1. Demonstrate knowledge of Package Stressing & Reliability Testing
2. Demonstrate knowledge of Step Plans, Chip Mechanical Drawings, & Tools to Access Designs
3. Demonstrate knowledge of Package-on-Package (POP) technology
4. Demonstrate knowledge of Laminate Materials
5. Demonstrate knowledge of Electronics Thermal Management
6. Demonstrate knowledge of Off-Die Signal & Capacitance Challenges
7. Demonstrate knowledge of Packaging Diagnostics & Failure Analysis Capability

1. Demonstrate knowledge of correct practices handling chemicals with limited shelf lives and high purities
2. Demonstrate knowledge of correct practices for moving modules during assembly in a manner which supports component tracking
3. Demonstrate knowledge of assembly inventory system

1. Demonstrate working knowledge of one or more assembly sectors
2. Demonstrate knowledge of tool configuration and modification to support varied test needs
3. Demonstrate best practices for continuous and batch operations of tool

1. Demonstrate knowledge of methods to collect and organize data
2. Demonstrate ability to up-load data into a Laboratory Information Management System (LIMS)

1. Demonstrate knowledge of safety practices related to tool maintenance
2. Demonstrate preventative maintenance of tools within one or more assembly sectors
3. Demonstrate tool repair and troubleshooting of tools within one or more assembly sectors

1. Demonstrate knowledge of metrology tooling related to microelectronic packaging assembly
2. Perform metrology of microelectronic modules
3. Interpret significance of metrology results

• Employee onboarding and integration • Success skills

• Microelectronic Assembly Overview, Fundamentals and Processes • Failure Analysis • Safety • Procurement process and tool

• Raw Material Handling • Component Processing • Data collection and Retention • Preventative Maintenance and Tool Repair • Metrology